LIGHT-EMITTING DIODE MODULE AND METHOD OF SEALING Russian patent published in 2019 - IPC F21V3/02 F21Y115/10 

Abstract RU 2695700 C2

FIELD: lighting.

SUBSTANCE: present invention relates to the field of lighting modules using light-emitting diodes (LED), and, in particular, to light-emitting diode modules suitable for luminaires with open lens plates. This document discloses a light-emitting diode module having a printed-circuit board having at least two layers, wherein the interface between two layers on the end surface of the printed-circuit board is coated with a protrusion of the optically transmissive cover plate. Same said optically transmissive cover plate is also used for coating at least one light-emitting diode located in printed-circuit board or on it.

EFFECT: disclosed is a light-emitting diode module and a sealing method.

13 cl, 12 dwg

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RU 2 695 700 C2

Authors

Van Asselt, Robert

Verhoeven, Mark Johannes Antonius

Vrehen, Joris Jan

Lijten, Gerardus Franciscus Cornelis Maria

Bax, Laurens

Van Den Eerenbeemd, Chris

Dates

2019-07-25Published

2016-01-25Filed