FIELD: chemistry.
SUBSTANCE: invention relates to a curing component, to an adhesive composition which provides a sufficiently strong bond and is easily applied on a substrate, as well as a method of forming a bond between two substrates. Curing component includes a reaction mixture of an amine-containing compound and a polymer phenol-containing compound. Amine-containing compound contains primary and/or secondary amino groups and is substantially free of hydroxyl functional groups. Amine-containing compound and the polymer phenol-containing compound are able to react with the epoxy-containing component when activated from an external energy source. Reaction mixture is capable of decomposition. Adhesive composition contains an epoxy-containing component, rubber particles having a core structure in a shell, and said curing component. Method of forming a bond between two substrates consists in that said adhesive composition is placed between the first and second substrates. Then, an external power source is used to harden the adhesive composition.
EFFECT: invention increases mechanical properties of the adhesive.
20 cl, 2 tbl, 8 ex
Title | Year | Author | Number |
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RU2595040C2 |
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RU2717938C1 |
Authors
Dates
2019-08-30—Published
2016-10-18—Filed