FIELD: manufacturing technology; lighting.
SUBSTANCE: invention relates to manufacturing and assembly of integrated circuits (IC), and in particular to production of light-emitting device (LED). Method of producing a light-emitting device, said method comprising steps of: providing an output frame, which includes at least one bearing element, wherein the bearing member comprises a plurality of conductive areas which are electrically isolated from each other; attaching contacts of at least one light-emitting device (LED) chip directly to current-conducting regions; separating carrying element from output frame, wherein only LED chip maintains spatial relationship between lateral areas of current conducting regions; and the dielectric material is placed between the current conducting areas after the carrying element is separated from the lead-out frame.
EFFECT: invention provides cheaper light-emitting products with potentially higher reliability and/or longer service life, as well as an economical method of making such light-emitting products.
16 cl, 7 dwg
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