FIELD: measuring equipment.
SUBSTANCE: invention relates to measurement equipment and can be used in medicine, instrument-making and machine building to measure deformation. Sensor for measurement of deformation on magnetostatic waves contains two identical on structure sensitive elements located exactly opposite to each other, and a resilient member with opposed force-receiving bases, in which a resiliently deformable screen is arranged in the form of a metal plate, passing between two sensitive elements and bending towards one of the sensitive elements. Sensitive elements include a gadolinium-gallium garnet-based substrate, a layer of material epitaxially grown thereon, in which magnetostatic waves are propagated, e.g. iron-yttrium garnet, magnets made in the form of magnetic plates and converters of electric signals into magnetostatic waves in form of strip antennae and at least two pairs of electrodes. Antenna and pairs of electrodes are located on a layer of material in which magnetostatic waves propagate. Electrodes of each pair are located on opposite sides of antenna and are connected by conductor, wherein electrodes located on one side of antenna of one sensitive element, are located at same level from each other and from antenna, as corresponding electrodes of other sensitive element, and electrodes located on other side of antenna of one sensitive element, are shifted relative to level of corresponding electrodes of other sensitive element. Magnet of each sensitive element is made in the form of two magnetic plates installed on the ends of the sensitive element in parallel to the antenna and electrodes and connected to each other by a magnetic conductor, wherein the sensitive elements are located on the bracket connected to one of the bases of the elastic element, and elastically deformable screen has through holes made exactly opposite strip antennae, electrodes and magnetic plates.
EFFECT: high sensitivity of the sensor on magnetostatic waves to low values of force and high accuracy of measuring deformation of the monitored object.
1 cl, 3 dwg
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Authors
Dates
2020-12-14—Published
2020-05-28—Filed