EMITTING MICRO-SLIT THERMOPHOTOVOLTAIC SYSTEM WITH TRANSPARENT EMITTER Russian patent published in 2021 - IPC H02S40/42 

FIELD: electrical communication engineering.

SUBSTANCE: assembly of thermophotovoltaic panel comprises heat sink and multiple thermophotovoltaic modules mounted on heat sink. Each thermophotovoltaic module has a photoelectric element separated from the emitter assembly by a gap. Emitter unit has an emitter and applies a force to the photoelectric element to maintain a gap. Thermophotovoltaic panel assembly can also use a layer of applying force on the emitter and bolted in place. Housing can be used to protect and transmit power to emitter. Heat sink is cantilevered in housing and forms space between thermophotovoltaic modules and inner surface of housing. Preferably, the housing maintains vacuum and, in its turn, evacuates the gap. Heat sink can be monolithic and be cooled by fluid pumped through it. Emitter can be transparent or at least partially transmitting radiation.

EFFECT: invention provides higher efficiency of converting energy received from a thermoelectric panel into electric energy.

15 cl, 19 dwg