FIELD: chemistry.
SUBSTANCE: invention relates to the field of creating cold-cured epoxy compositions for adhesive, sealing and repair compositions. The cold-cured epoxy composition includes, by weight: epoxy diane resin ED - 20-100, a plasticizer that uses dioctyl phthalate (di-n-octyl ether of o - phthalic acid) or EDOS, which is a mixture of dioxane alcohols and their high-boiling esters, 4-8, a nanoscale filler that uses fullerene C2p, with n being at least 30, or titanium dioxide with an average particle size less than 100 nm, 0.6, hardener is polyethylene polyamine 11-16, as well as an epoxyurethane oligomer with a content of free epoxy groups of 4.2-4.85%, which is the product of the interaction of oligotetramethylene oxide diol with a molecular weight of 1,400 and 2,4-toluylenediisocyanate, followed by the interaction of the resulting product with glycidol, 5-30.
EFFECT: invention is aimed at providing a composition with consistently high adhesive and technological properties, increasing the critical deformations of the cured material from the composition in a wide temperature range up to minus 70°С while maintaining high physical and mechanical properties with a short preparation and curing time at room temperature.
1 cl, 2 tbl, 20 ex
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Authors
Dates
2021-06-09—Published
2018-11-29—Filed