FIELD: radio engineering.
SUBSTANCE: invention relates to the field of radio electronics, in particular, to a radio frequency (RF) system including planar RF apparatuses interconnected by a non-galvanic connection. The technical result is achieved by the fact that two planar RF apparatuses are separated by a dielectric layer, wherein each of the RF apparatuses includes a set of conducting pads located on the surface, surrounded by a common electrode serving as a grounded metal shield, wherein the conducting pads of the first RF apparatus and the conducting pads of the second RF apparatus are facing each other, implementing a capacitive connection between the conducting pads.
EFFECT: technical result is a reduction in the complexity and a reduction in size, as well as an increase in the reliability and manufacturability of the connection between the elements of the RF system.
11 cl, 5 dwg
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