FIELD: radio-frequency module.
SUBSTANCE: millimetre-wave unit (1) comprising the first millimetre-wave module (2), the second millimetre-wave module (3) and the connector (4) configured for detachable connection of the first millimetre-wave module (2) and the second millimetre-wave module (3). The connector (4) comprises the first element (5) of the connector associated with the first millimetre-wave module (2). The first millimetre-wave module (2) comprises the first millimetre-wave substrate (7) and RFIC (8), and the second millimetre-wave module (3) comprises the second millimetre-wave substrate (9) and the antenna array (10). The connector (4) is configured to transmit at least one signal between the millimetre-wave RFIC (8) and the millimetre-wave antenna array (10) when the first millimetre-wave module (2) and the second millimetre-wave module (3) are interconnected.
EFFECT: preservation of sufficient radio frequency characteristics while reducing the size.
22 cl, 10 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| WIRELESS CONNECTION FOR HIGH-SPEED DATA TRANSMISSION | 2021 |
|
RU2782439C1 |
| ELECTRONIC WIRELESS COMMUNICATION DEVICE (EMBODIMENTS) | 2020 |
|
RU2815618C2 |
| ELECTRONIC DEVICE INCLUDING ANTENNA AND HEAT DISSIPATING STRUCTURE | 2020 |
|
RU2811572C2 |
| NON-GALVANIC CONNECTION FOR PLANAR RADIO FREQUENCY APPARATUSES | 2020 |
|
RU2754307C1 |
| ANTENNA AND THE ELECTRONIC DEVICE CONTAINING IT | 2020 |
|
RU2789661C1 |
| PHASED ARRAY ANTENNA WITH ADAPTABLE POLARIZATION | 2016 |
|
RU2629534C1 |
| WIRELESS BOARD-TO-BOARD CONNECTION FOR HIGH SPEED DATA TRANSFER | 2020 |
|
RU2744994C1 |
| WIDE-ANGLE PRINTED ANTENNA ARRAY | 2021 |
|
RU2797647C2 |
| SEMICONDUCTOR DEVICE, METHOD TO MANUFACTURE SEMICONDUCTOR DEVICE, DEVICE TO TRANSMIT SIGNALS OF MILLIMETRE RANGE VIA DIELECTRIC, METHOD TO MANUFACTURE DEVICE AND SYSTEM TO TRANSMIT SIGNALS OF MILLIMETRE RANGE VIA DIELECTRIC | 2009 |
|
RU2507631C2 |
| ELECTRONIC DEVICE | 2022 |
|
RU2820193C2 |
