RADIATOR FOR COOLING THE ELECTRONIC COMPONENT Russian patent published in 2021 - IPC H01L23/467 H05K7/20 

FIELD: heat-removal devices.

SUBSTANCE: invention relates to devices for removing heat from electronic components. This is a radiator for cooling an electronic component containing several separate corrugated plates bonded to one or two heat-absorbing surfaces that are in contact with the heat-generating surfaces of the electronic component. The corrugations of the plates are located in relation to the heat-absorbing surface at an angle ranging from 20 degrees to 75 degrees. The corrugations of each plate can be located between the corrugations of adjacent plates facing them, can be located at an angle to the corrugations of adjacent plates, can have a wave-like shape, the corrugations on each plate can intersect with each other.

EFFECT: increase in the thermal efficiency of the radiator, which will reduce its weight and size characteristics, and reduce its aerodynamic drag.

6 cl, 6 dwg