FIELD: semiconductor testing.
SUBSTANCE: invention relates to devices for electrical testing of semiconductor devices. The method for arrangement the modules in the measuring device consists in the fact that the component measuring modules having an end lamella for connecting to the lamella connector of the bus of the backplane and a lamella on one of the board sides of the measuring module for connecting to the analog bus of the board of the contacting device are pushed along the guide parallel to each other until they snap in the lamella connector of the backplane. The cover with the contact device board is installed from above, combining the side lamellae of the measuring modules with lamellar connectors into a bus, which is connected to the terminals of the contact device with the semiconductor device under test on the reverse side of the contact device board.
EFFECT: invention improves the maintainability of the measuring device and simplifies the installation of measuring modules and a contacting device with the semiconductor devices under test.
3 cl, 3 dwg
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