FIELD: curable resins.
SUBSTANCE: invention relates to curable resins and can be used for the manufacture of heat-resistant three-dimensional objects using DLP 3D printing. Curable resins consist of a heat-resistant polymer - poly-2,2'-(n-oxydiphenylene)-5,5'-dibenzimidazole with a molecular weight of 100-180 kDa, an aromatic acrylamide binder - 3,3-di(4'-acrylamidophenyl)phthalide, active solvent - N,N-dimethylacrylamide and photoinitiator - bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide.
EFFECT: formation of products of a given architecture by the DLP 3D printing method in a short period of time, characterized by a heat resistance of 401-422°С and a tensile strength of 88.2-121.1 MPa.
1 cl, 3 ex
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