PHOTOSENSITIVE COMPOSITIONS FOR THE MANUFACTURE OF HEAT-RESISTANT MECHANICALLY STRONG OBJECTS BY DLP 3D PRINTING Russian patent published in 2023 - IPC C08L65/02 C08L79/04 C08L81/00 G03F7/04 B29C64/10 

FIELD: 3D printing.

SUBSTANCE: invention relates to photosensitive compositions and can be used for the manufacture of heat-resistant mechanically strong three-dimensional objects by DLP 3D printing. Photosensitive compositions consist of a heat-resistant polymer - N-allyl-functionalized poly-2,2'-(p-oxydiphenylene)-5,5'-dibenzimidazole with a degree of functionalization of 50-100% and a molecular weight of 50-120 kDa; a thiol component, which is tetrakis(3-mercaptopropionate)pentaerythritol, ethylene glycol bis-mercaptoacetate, 1,3-dimercaptobenzene or 1,4-dimercaptobenzene; photoinitiator - bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; hydroquinone and solvent - N-methyl-2-pyrrolidone.

EFFECT: technical result provided by the above combination of features is the formation of products of a determined architecture in a short period of time with a heat resistance of 386-451°C and tensile strength 103.6-164.7 MPa by DLP 3D printing.

1 cl, 3 ex