FIELD: 3D printing.
SUBSTANCE: present invention relates to a photo-curable composition for the manufacture of heat-resistant products of set architecture by DLP 3D printing, different in that the photo-curable composition has the following composition (wt.%): N-allyl-functionalized poly-(m-phenylene)isophthalamide with a functionalization degree of 61-80% and molecular weight of 30-60 kDa – 15-25; a thiol component, which is selected from tetrakis(3-mercaptopropionate)pentaerythrite, ethylene glycol bis-mercaptoacetate, 1,3-dimercaptobenzol, 1,4-dimercaptobenzol – 9-25; bis(2,4,6-trimethylbenzoyl)-phenylphosphinoxide – 2; hydroquinone – 0.1; N-methyl-2-pyrrolidone – 47.9-73.9.
EFFECT: present invention provides reduction in sensitivity of a photo-curable composition to the presence of oxygen and air moisture, increase in heat resistance, mechanical strength of products, and reduction in time of their formation.
1 cl, 4 ex
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