FIELD: instrumentation.
SUBSTANCE: invention relates to the field of optoelectronic instrumentation and pertains to a method for protecting optoelectronic apparatus from a powerful laser complex (PLC). The method includes receiving optical emission by a matrix optoelectronic tool (OET), measuring the parameters of laser location emission (LLE) and the spatial parameters of the image thereof on a photosensitive matrix of the OET. Based on the values of the LLE parameters, the type of PLC is identified, and the parameters of powerful laser emission (PLE) thereof are determined. Based on the values of the LLE parameters of the PLC, the spatial parameters of the image thereof on the photosensitive matrix of the OET, the set parameters of the lens of the optoelectronic tool and the parameters of PLE, the spatial parameters of the image of PLE on the photosensitive matrix of the optoelectronic tool are determined. The OET is protected from damage by screening the area in front of the photosensitive matrix with spatial parameters equal to the resulting spatial parameters of the image of powerful laser emission of the PLC on the photosensitive matrix of the OET for the time between the time of ending of the LLE irradiation and the time of the PLE irradiation.
EFFECT: increase in the efficiency of protecting the OET from damage by optical emission.
1 cl, 2 dwg
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Authors
Dates
2022-05-18—Published
2021-04-12—Filed