METHOD FOR OBTAINING MULTILAYER NANOWIRES CONSISTING OF ALTERNATING LAYERS OF COPPER AND NICKEL-COPPER ALLOY Russian patent published in 2022 - IPC C25D1/04 B82B3/00 

FIELD: template electrodeposition of metals.

SUBSTANCE: invention relates to the processes of template electrodeposition of metals and can be used in the manufacture of magnetic memory devices. The method includes electrodeposition of alternating layers of copper and a nickel-copper alloy (hereinafter referred to as the alloy) in the pores of a polymer film 10-12 mcm thick located on the front surface of the copper cathode, with the number of pores (1.0-1.2) ×10⁹ per 1 cm², their diameter is 70-100 nm using a copper anode from an electrolyte containing nickel sulfate heptahydrate, boric acid, copper sulfate pentahydrate and sodium lauryl sulfate, at an electrolyte temperature of 20-45°C, at the same time, the overall surface of the anode exceeds the overall surface of the cathode by at least 1.5 times, with alternating constant values ​​of the overall current density and a constant duration of deposition of layers of each type, to determine which a constant voltage of 0.6-0.8 V is first applied to the electrodes and within 4-5 minutes measure the overall current density during the deposition of copper, then a constant voltage of 1.5-1.8 V is applied and the overall current density of the alloy deposition is measured, fixing the time and current density corresponding to the moment the pores are filled with the alloy and the beginning of a sharp rise in the current-time curve, the ratio of the true and overall cathode surface is calculated, the true current density in pores and time of layer deposition. After that, deposition is carried out on the same cathode plates with a given layer thickness at two alternating constant values ​​of the overall current density, while the deposition of copper layers is carried out at an overall current density of 70-85% of the measured value, respectively, increasing the deposition time.

EFFECT: method makes it possible to stabilize the thickness of the copper and alloy layers, arbitrarily adjust the thickness of these layers, eliminate the possibility of increasing the thickness of the layers as the pore channels are filled with copper and the alloy, and control the composition of the alloy.

1 cl, 3 ex