METHOD FOR TRANSFER OF EMBOSSED STRUCTURE TO SURFACE OF COVERING MEANS, AND COMBINED MATERIAL USED AS MATRIX FOR EMBOSSING Russian patent published in 2022 - IPC B29C43/46 B29C59/04 B44B5/02 C09D133/12 C09D4/06 C09J7/29 

Abstract RU 2778706 C2

FIELD: material processing.

SUBSTANCE: invention relates to the field of production of embossed structures, which are used to impart optical, bionic, and/or tactile properties to material, and concerns a method for the transfer of an embossed structure to the surface of covering means and combined material used as a matrix for embossing. The method for the transfer of the embossed structure to the surface of covering means (B2a) includes stages of: (1-i) application of covering means (B2a) to a part of the surface of substrate (F2); and (2-i) partial embossing of covering means (B2a) partially applied to the surface of substrate (F2) by means of embossing tool (P2) with at least one matrix (p2) for embossing, wherein, after embossing, combined material (F2B2aB1F1) is obtained, or (1-ii) application of covering means (B2a) to a part a partially embossed surface of partially embossed and partially cured coating (B1) used as matrix (p2) for embossing of embossing tool (P2) of combined material (B1F1) from substrate (F1) to obtain combined material (B2aB1F1), and (2-ii) application of substrate (F2) to a part of the surface of combined material (B2aB1F1), formed by (B2a) to obtain combined material (F2B2aB1F1), and (3) partial curing of covering means (B2a) inside resulting combined material (F2B2aB1F1) to obtain combined material (F2B2B1F1), wherein covering means (B2a), during the entire time of partial curing, is in contact with partial combined material (B1F1) used as matrix (p2) for embossing in combined material (F2B2aB1F1), and (4), if necessary, removal of combined material (F2B2) in combined material (F2B2B1F1) with combined material (B1F1) used as matrix (p2) for embossing, wherein stages (1-i) and (2-i), or (1-ii) and (2-ii) are performed using combined material (F1B1) from substrate (F1) used as matrix (p2) for embossing of embossing tool (P2) and at least partially embossed and at least partially cured coating (B1), and covering means (B1a) used for manufacture (B1) of combined material (F1B1) is a radiation-cured covering means with a certain composition, to combined means (F1B1), as well as the use of combined material (F1B1) as matrix (p2) for embossing of embossing tool (P2) for the transfer of the embossed structure to at least part of the surface of covering means (B2a).

EFFECT: invention provides a method for the transfer of embossed structures to a covering means and to substrates with such a covering means with appropriate microstructures and/or nanostructures, which makes possible sufficient accuracy of copying a shape when transferring embossed structures, so that the depth of modulation is not lost during embossing, and which makes it possible to manufacture a matrix for embossing the most suitable for reuse for transfer of embossed structures, or which can be carried out using such a matrix for embossing.

15 cl, 2 dwg, 5 tbl

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RU 2 778 706 C2

Authors

Kues Jan-Bernd

Piontek Susanne

Exner Joerg

Kleine-Bley Birgit

Von Der Aa Robert

Lorenz Michael

Bergmann Frank

Schipper Wilfried

Krabbenborg Sven Olle

Duennewald Joerg

Dates

2022-08-23Published

2019-03-28Filed