FIELD: physics.
SUBSTANCE: group of inventions relates to a method of transferring an embossed structure onto at least part of the surface of a coating composition (C2a) using a composite material (S1C1) as an embossing die. Method of transferring the embossed structure onto at least a portion of the surface of the coating composition (C2a) using a composite material (S1C1) includes steps of (1) providing a composite material (S1C1), (2-I) applying a coating composition (C2a) to at least a portion of the surface of a substrate (S2) to obtain a composite material (S2C2a), (3-I) at least partial embossing of composition (C2a) for coating composite material (S2C2a) using composite material (S1C1), (4) at least partial curing of embossed coating composition (C2a). Coating composition (C1a), which is used to obtain at least partially embossed and cured coating (C1) of composite material (S1C1), is a radiation-curable coating composition containing (a) 1–45 wt.% of at least one cross-linkable polymer and/or oligomer, (b) 40–95 wt.% of at least one reactive diluent, (c) 0.01–15 wt.% of at least one photoinitiator and (d) 0–5% by weight of at least one additive. At least one cross-linkable polymer and/or oligomer (a) contains a total amount of at least 25% by weight, preferably at least 50% by weight, more preferably at least 90% by weight, very preferably 100% by weight, based on the total weight of the total crosslinkable polymer and/or oligomer contained in coating composition (C1a) of at least one silicone (meth) acrylate oligomer. Group of inventions also relates to composite material (S1C1) and use of this material as die (e2) for embossing device (E2) to transfer the embossed structure onto a part of the surface of the coating composition (C2a).
EFFECT: group of inventions provides improved accuracy of molding along the entire width of the stamping plate.
18 cl, 5 tbl, 4 dwg
