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(19)

(11)

2 782 060

(13)

(51)

IPC

C09K5/00(2006-01-01)

C08L83/04(2006-01-01)

C09D5/34(2006-01-01)

C01B32/158(2017-01-01)

C08K3/13(2018-01-01)

B82Y30/00(2011-01-01)

(21) (22)

Application

2021111192, 2021-04-20

(24)

Start date

2021-04-20

(22)

Actual filing date

2021-04-20

(45)

Published

2022-10-21

(72)

Inventor

Kishchuk Petr SergeevichLyalin Nikolaj Semenovich

(73)

Holder

Aktsionernoe Obshchestvo Kosmicheskij Nauchno-Proizvodstvennyj Tsentr Imeni M.V. Khrunicheva"

HEAT-CONDUCTING ORGANOSILICON PASTE Russian patent published in 2022 - IPC C09K5/00 C08L83/04 C09D5/34 C01B32/158 C08K3/13 B82Y30/00

Abstract RU 2782060 C1

FIELD: chemistry.

SUBSTANCE: invention relates to the field of production of heat-conducting materials. Proposed is polydimethylsiloxane-based heat-conducting organosilicon paste for coupling heat-stressed apparatus and parts, containing carbon nanotubes as a filler, and characterised by the latter in an amount from 0.1 to 0.2 vol.% being uniformly distributed in the volume of the paste by mixing.

EFFECT: possibility of increasing the heat conductivity of thermal paste based on an organosilicon material.

1 cl, 1 tbl, 3 ex

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RU 2 782 060 C1

Authors

Kishchuk Petr Sergeevich

Lyalin Nikolaj Semenovich

Dates

2022-10-21—Published

2021-04-20—Filed