INSTALLATION OF CONTACT PHOTOLITHOGRAPHY FOR SEMICONDUCTOR WAFERS WITH A BASE CUT Russian patent published in 2023 - IPC H01L21/31 H01L31/18 

FIELD: photolithography devices.

SUBSTANCE: invention can be used in the manufacture of photoconverters. The proposed contact photolithography installation for semiconductor wafers with a base cut, including a light source located in a box with a loading window, double microscopes with monitors, spatially combined and fixed on a tabletop, a carriage with a vacuum alignment table placed on it, a photomask for the front side of semiconductor wafers, pushers, with the vacuum alignment table made in form of a photomask for the back side of the semiconductor wafers, equipped with vacuum holes, a sealing frame, mounting elements in the form of disks, in addition, has the photomask for the front side of the semiconductor wafers made with recesses for the above-mentioned disks, in addition, the pushers are equipped with swivel levers, which contain pressure rollers and plates of permanent magnets, creating magnetic coupling with microscrews, in addition, a damper is introduced, located on the carriage. On the face side of the photomask for the face side of semiconductor wafer support bars are fixed, made with the possibility of rolling along the pressure rollers of the rotary pusher levers, and the distance from the axis of rotation of the rotary pusher lever to the pressure roller is chosen to be half the distance from the axis of rotation of the rotary pusher lever to its point of magnetic coupling with microscrews.

EFFECT: invention provides increased productivity by reducing the time for matching the patterns of the photomask and the plate, increasing the accuracy of matching by means of looseness free smooth positioning of the photomask.

1 cl, 4 dwg