RESONANT MW TERMINATION INTEGRATED IN A PRINTED CIRCUIT BOARD SUBSTRATE Russian patent published in 2023 - IPC H01P1/26 H01Q1/38 H01Q1/52 

FIELD: radio engineering.

SUBSTANCE: termination integrated into a printed circuit board substrate. A termination integrated into the printed circuit board, as well as an antenna array and a power divider are proposed. The termination includes a fragment of at least one transmission line terminated in the termination in the form of an exciting probe, an intermediate patch, an upper resonator patch, an upper metal ground layer coplanar with the upper patch. The gap between the upper resonator patch and the upper metal layer is filled with a resistive material. At least one transmission line is located in the printed circuit board between the lower ground layer of the printed circuit board and the upper layer of the printed circuit board, in which the upper resonator patch, the resistive material and the upper metal layer are located, the intermediate patch is located in the printed circuit board between the layer in which at least one transmission line is located, and said upper layer, the excitation probe, the intermediate patch and the upper resonator patch are connected to each other by electromagnetic coupling.

EFFECT: reducing the size, as well as increasing the reliability and speed of wireless data transmission in antenna arrays that use terminations.

12 cl, 15 dwg