HOUSING FOR LIQUID COOLING OF THE EE UNIT Russian patent published in 2023 - IPC H05K7/20 

FIELD: heat engineering.

SUBSTANCE: invention relates to a method for improving the reliability of the body of the liquid cooling of the electronic equipment unit. In the housing of the liquid cooling of the electronic equipment unit, which has a monolithic structure, made of a highly thermally conductive material, with the electronic equipment elements installed on it, channels are made at a given depth, having a different trajectory, shape and cross-sectional dimensions and containing structural bends that form a system channels, at the inlet and outlet of which fittings are installed for supplying and discharging coolant. The channels are sealed with surfacing material, and the places of change in the dimensions of the cross section and the structural bends of the channels contain smooth transitions, ensuring no cavitation that destroys the housing.

EFFECT: production of a monolithic structure of the housing for liquid cooling of the electronic equipment unit and the exclusion of cavitation destroying the housing in the coolant.

1 cl, 2 dwg