FIELD: electrical engineering.
SUBSTANCE: socket for placing the device module, made for electrical connection of the module in a mechanically connected state in the first place of the module, has in the first place a mechanical degree of freedom across the direction of insertion between the module and the substrate, and the mechanical connection of the socket is determined by the mechanical degree of freedom of the first place in the second place of the module, which differs from the first place.
EFFECT: manufacturing a substrate for a signal processing device with the possibility of dense arrangement of device modules on the substrate and with the possibility of simplifying the electrical connection.
19 cl, 6 dwg
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