HOUSING OF TELECOMMUNICATION EQUIPMENT WITH FORCED COOLING OF ELECTRONIC BOARDS Russian patent published in 2024 - IPC H05K7/20 G06F1/20 G12B15/04 

FIELD: facilities for arrangement of telecommunication equipment.

SUBSTANCE: invention relates to the field of telecommunication equipment placement means, such as housings, specifically to housings with means of forced cooling of electronic boards, relates to communication means and is intended for arrangement of boards of telecommunication equipment and forced cooling of these boards. Housing contains walls, a backing board with connectors located parallel to the rear wall, fans installed respectively on the side walls of the housing and parallel to them. Housing is conditionally divided into three parts, in the lower part between the lower wall of the housing and guides for installation of boards there is a hollow space, besides, the hollow space is closed from the front side of the housing by a plate with perforation. In the middle part of the housing the guides are installed parallel to each other; there are air gaps between the guides. Boards installed in guides are located vertically. Middle and upper parts of the housing are separated by a partition; the partition has a hole cut above the boards which release the greatest amount of heat, and several parallel slots above the boards which release the least amount of heat. Blowing fans are installed in the upper part of the housing on the side walls.

EFFECT: increasing the cooling efficiency of the boards, emitting the greatest amount of heat, located in the housing for boards with different degrees of heat release, installed in the housing vertically, as well as in selective forced cooling of all boards.

1 cl, 2 dwg