FIELD: physics.
SUBSTANCE: shielded device housing with cooling of heat-releasing elements enclosed therein has a housing cooling system formed by an inlet hole lying on the back wall, inner and outer left side, right side, front and back walls, which form closed inner and outer loops, and configured to allow passage of a cooling air stream between the inner and outer walls, as well as outlet holes, top and bottom covers, wherein the inner side walls are in form of radiators. The inner closed loop of the device housing, which is shielding, has shielding walls in form of radiators placed with possibility of forming shielded chambers, wherein the outer front wall, which is in form of a radiator, is shielding and forms with the front panel and inner side walls an additional shielded chamber. Inside each chamber there are functionally assembled heat-releasing elements, wherein all shielded chambers are separated by cooling channels, and outlet holes are made on the front panel.
EFFECT: enabling shielding of housing compartments and high efficiency of cooling electronic equipment.
8 cl, 3 dwg
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Authors
Dates
2012-07-20—Published
2011-03-30—Filed