TWO-COMPONENT COPOLYMERS LLDPE WITH IMPROVED IMPACT RESISTANCE AND TEAR RESISTANCE AND METHODS FOR PRODUCTION THEREOF Russian patent published in 2024 - IPC C08L23/08 C08F10/02 C08J5/18 C08L23/04 

Abstract RU 2819827 C2

FIELD: chemistry.

SUBSTANCE: invention relates to a film containing an ethylene polymer composition. Film contains an ethylene polymer composition of the following composition: (i) a uniformly branched first ethylene polymer component having an HLMI/MI ratio in range of 12 to 25, where the first ethylene polymer component is a copolymer of ethylene and C4-C10 α-olefin; and (ii) a uniformly branched second ethylene polymer component with a higher density than the first ethylene polymer component, where the second ethylene polymer component has an HLMI/MI ratio in range of 12 to 25, and where the second ethylene polymer component is an ethylene homopolymer or copolymer of ethylene and C4-C10 α-olefin; wherein the amount of the second ethylene polymer component ranges from 15 to 35 wt.% relative to the total weight of the first ethylene polymer component and the second ethylene polymer component. Said ethylene composition contained in the film is characterized by density of 0.912 to 0.925 g/cm3, Mw/Mn ratio from 2 to 3, melt flow index, determined in accordance with ASTM D1238 at 190 °C with weight of 2160 g, from 0.3 g/10 min to 2 g/10 min, parameter CY-a from 0.35 to 0.7 and an ATREF curve containing at least two peaks, with a first peak at temperature from 60 to 72 °C and second peak at temperature from 92 to 104 °C. Invention also relates to an ethylene polymer composition for producing a film, a method of increasing tear strength of a film and a method of producing a film.

EFFECT: obtaining a film having excellent impact resistance, tear resistance and excellent optical properties, despite the presence of a second ethylene polymer component with higher density.

20 cl, 9 dwg, 4 tbl, 40 ex

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RU 2 819 827 C2

Authors

Praetorius, Jeremy M.

Tso, Chung Ching

Sukhadia, Ashish M.

Inn, Yongwoo

Yang, Qing

Blagg, John T.

Dates

2024-05-27Published

2020-03-16Filed