FIELD: physics.
SUBSTANCE: invention relates to heat engineering and can be used in the manufacture of heat flow sensors used to measure heat flows on the surface of various objects, in particular, when measuring non-stationary heat flows under conditions of action of aerodynamic loads during ground thermal and heat resistance tests of structural elements of high-speed aircraft and objects of space equipment, as well as for control of heat flows during tests. Disclosed is a method of making a heat-sensing element of a heat flow sensor with a transverse temperature gradient, which includes making a disc from a thermocouple alloy, for example from constantan, forming a wire at the end of another thermocouple alloy, for example copper, ball is melted and welded to the disc, the ball is pressed to the surface of the disc in its centre, and the axis of the wire with the ball is placed at angle of 40÷50° to disc surface, thereafter, a single laser pulse is applied to the ball perpendicular to the surface of the disc, the ball is fused and welded to the surface of the disc, wherein the optical axis of the laser pulse coincides with the centre of the ball and the centre of the disc.
EFFECT: high accuracy of the heat flow sensor, simplified process, reduced labour input in making fuel elements.
5 cl, 3 dwg
Title | Year | Author | Number |
---|---|---|---|
METHOD OF MANUFACTURING HEAT-SENSING ELEMENT OF HEAT FLOW SENSOR WITH TRANSVERSE TEMPERATURE GRADIENT AND DEVICE FOR ITS IMPLEMENTATION | 2023 |
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METHOD FOR MANUFACTURING HEAT-SENSING ELEMENT OF HEAT FLOW SENSOR WITH TRANSVERSE TEMPERATURE GRADIENT | 2023 |
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RU2812040C1 |
HEAT FLOW SENSOR WITH TRANSVERSE TEMPERATURE GRADIENT AND METHOD OF MANUFACTURING THEREOF | 2023 |
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0 |
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SU297875A1 | |
HEAT FLOW PICKUP | 0 |
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SU892239A1 |
DEVICE FOR MAKING THERMOCOUPLES | 2023 |
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RU2812459C1 |
HEAT FLUX SENSOR | 0 |
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METHOD FOR MEASURING DENSITY OF HEAT FLOW | 2020 |
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RU2737681C1 |
SENSOR OF HEAT FLOW AND PROCESS OF ITS MANUFACTURE | 1997 |
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RU2131118C1 |
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SU1064163A1 |
Authors
Dates
2024-06-17—Published
2023-06-02—Filed