FIELD: technological processes.
SUBSTANCE: present invention relates to the glass ceramic surface preparation technology for the chemical application of current-conducting coatings or semiconductor films, for example, lead or cadmium sulphides, and can be used in production of microchips and photocells. Method for preparation of glass ceramic surface “СТ-50-1” involves undercutting glass ceramic surface with 5 vol.% aqueous solution of hydrofluoric acid for 1.5–2 minutes at room temperature, etching glass ceramic with 40 wt.% aqueous solution of KOH or NaOH at temperature of 60–70 °C for 15–20 minutes and subsequent activation with 0.02 M aqueous solution of AgNO3 for 15–20 minutes at room temperature.
EFFECT: providing a simple method of preparing glass ceramic for uniform application of a current-conducting or semiconductor coating with high adhesion to the glass ceramic base.
1 cl, 7 ex
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Authors
Dates
2024-11-19—Published
2024-04-02—Filed