METHOD FOR WIRE MOUNTING OF SEMICONDUCTOR CHIP OF INTEGRATED MICROCIRCUIT AND INSTALLATION FOR ITS IMPLEMENTATION Russian patent published in 2025 - IPC B23K20/00 B23K101/40 H01L23/49 

FIELD: electricity.

SUBSTANCE: group of inventions relates to semiconductor technology and can be used for mounting wire leads of unpacked integrated circuits (UIC). Wire conductor is connected to contact pads of crystal with formation of bridges and its cutting with obtaining of fixed length. Cutting is performed by means of working end of welding tool at its movement and conjugation with limiter of wire output length. After cutting, the welding tool is lifted and moved to the point of connection of the wire conductor with the next contact pad of the crystal. Welding head of the installation is equipped with vertical and horizontal drives. In centres of welding head rocking, which are located in one horizontal plane with working end of welding tool, two double-arm levers are installed, on one of which there is a welding tool with a holder, and on the other – wire clamping unit with jaws. Cutting length limiter is configured to adjust its position along the axes.

EFFECT: group of inventions provides higher efficiency and reduced labour costs for installation of UIC while improving assembly quality.

8 cl, 7 dwg