METHOD FOR INSTALLATION OF WIRE CONDUCTORS ON BONDING PADS OF SEMICONDUCTOR APPARATUSES Russian patent published in 2021 - IPC H05K3/34 B23K20/10 B23K101/40 

FIELD: semiconductors.

SUBSTANCE: invention can be used for installation of wire conductors by ultrasonic welding in manufacture of semiconductor apparatuses. Static pressure is applied to the connected elements by means of an ultrasonic electrode. Welding current is supplied via a wire conductor to heat the connected elements, and ultrasonic vibrations are supplied to the connection area. Before ultrasonic vibrations are applied to the connection area, near the ultrasonic electrode, a contact electrode is additionally directed to the welded conductor located on the bonding pad or outside thereof, applying static pressure thereto to press the wire conductor and obtaining a segment of the conductor between said electrodes. The resistance of said segment of the conductor is measured and the voltage during welding is set by the obtained value of resistance to maintain the value of the welding current, which is 0.8 to 0.9 of the value of the melting current of the more low-melting connected element. A weld joint is formed under the working end of the ultrasonic electrode.

EFFECT: improved technology for installation of wire conductors on bonding pads of semiconductor apparatuses.

1 cl, 2 dwg, 2 ex