FIELD: electric engineering. SUBSTANCE: phenolformaldehyde resin and colophony taken at the definite ratio were mixed in porcelain plate followed by heating at stirring up to 70-100 C up to the complete colophony dissolving. Then epoxy resin, powdery scaly silver and benzylic alcohol were added to the preliminary cooled mixture. Paste showing required viscosity is prepared by thus. Paste is applied on the backing through the steel net and subjected for thermal working at 220 C for 10 min in the air. Tinplating of conducting films is carried out in baths with solder for 3-5 s at 220 ± 10 C. EFFECT: decreased specific resistance of composition. 2 cl, 1 tbl
Title | Year | Author | Number |
---|---|---|---|
ELECTRICITY CONDUCTING COMPOSITION PRODUCTION PROCESS | 1986 |
|
SU1436748A1 |
SOLDERING AND TINNING PASTE | 1987 |
|
SU1743101A1 |
SOLDERING AND TIN-PLATING PASTE | 1987 |
|
SU1743100A1 |
INK FOR STENSIL PRINTING | 0 |
|
SU852922A1 |
COMPOSITE MATERIAL BASED ON COPPER ALLOY | 1991 |
|
RU2096847C1 |
LIGHT-SENSITIVE COMPOSITION FOR PRODUCING DIELECTRIC LAYERS OF THICK-FILM MICROCIRCUITS | 0 |
|
SU1123012A1 |
PASTE FOR SOLDERING AND TANNING | 1987 |
|
SU1743102A1 |
CURRENT CONDUCTING COMPOSITION | 0 |
|
SU974416A1 |
ELECTRICALLY CONDUCTIVE ADHESIVE | 0 |
|
SU1052532A1 |
MAGNETODIELECTRIC MATERIAL | 0 |
|
SU750584A1 |
Authors
Dates
1995-09-27—Published
1986-03-10—Filed