SOLDERING PASTE FOR TINNING AND SOLDERING MICROCIRCUITS Russian patent published in 1995 - IPC

Abstract SU 1603658 A1

FIELD: pastes for soldering microcircuits. SUBSTANCE: paste contains (% ); triethanolamine stearate (2.3-4.85); triethanolamine (5.15-7.70); powdered solder the balance. Such paste provides pulse-mode operation without exfoliation up to 28 hours. Fluxing activity of the paste consists 2.3-3.1 percentage units. Such paste has low corrosion activity and hygroscopicity, providing absence of short circuiting. EFFECT: increased time period of paste operation without exfoliation in a pulse mode with interruption period (0.1-4.0)s. 1 cl, 1 tbl

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SU 1 603 658 A1

Authors

Stepanova I.P.

Belov E.L.

Butin A.V.

Dates

1995-08-27—Published

1987-11-09—Filed