FIELD: process engineering.
SUBSTANCE: proposed flux may be used wiring radioelectric components and IC on p.c.b. operated in harsh environment. Flux comprises activator consisting of the mix of carboxylic acids 3-10 wt %, organic solvent made up of the mix of alcohols - 30 wt % and esters - 60-70 wt %. All components are ecologically safe and based on natural biodegradable stock. Solder does not contain amines, surfactants and water.
EFFECT: high surface electrical resistance.
4 tbl, 1 ex
| Title | Year | Author | Number |
|---|---|---|---|
| FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463143C2 |
| FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463145C2 |
| SOLDER PASTE | 2010 |
|
RU2450903C2 |
| SOLDER PASTE | 2010 |
|
RU2438845C1 |
| SOLDER PASTE | 2016 |
|
RU2623554C1 |
| SOLDER PASTE | 2016 |
|
RU2623571C1 |
| DETERGENT | 2010 |
|
RU2445352C1 |
| LIQUID CLEANING COMPOSITION | 2010 |
|
RU2445353C1 |
| SOLDER PASTE | 2015 |
|
RU2591920C1 |
| SOLDERING FLUX FOR WASHINGLESS LOW-TEMPERATURE SOLDERING | 1993 |
|
RU2096152C1 |
