FIELD: epoxy-based structural film adhesives.
SUBSTANCE: structural film adhesive of low flammability is described, including an epoxy resin, a brominated epoxidized resin, a polysulfone and a dicyandiamide hardener, characterized in that it comprises a mixture of epoxy resins selected from the group of resins of the ED-16, ED-20, ED-22 brands as an epoxy resin, and additionally tetrafunctional chlorine-containing resin and diglycidyl ether of resorcinol in the following ratio of components, parts by weight: a mixture of epoxy resins 28.4-33.7; epoxidized brominated resin 39.6-48.5; tetrafunctional chlorine-containing epoxy resin 13.0-18.2; resorcinol diglycidyl ether 7.5-10.5; polysulfone 23.5-28.1; dicyandiamide 11.5-12.3.
EFFECT: reduction of fire hazard during operation of glued structures made of PCM, including honeycomb structures, ensuring their performance at temperatures up to 120°C.
2 cl, 3 tbl, 6 ex
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SU781205A1 |
