FIELD: chemistry.
SUBSTANCE: invention relates to curing compositions for epoxy resin based systems. The invention discloses a curing composition for epoxy resins, containing a mixture of 1,3-bis(aminomethyl)cyclohexane and 1,4-bis(aminomethyl)cyclohexane, a prepolymer curing composition for epoxy resins, containing a product of reacting epoxide with a mixture of 1,3-bis(aminomethyl)cyclohexane and 1,4-bis(aminomethyl)cyclohexane, as well as a method of preparing the prepolymer curing composition, a method of gluing two substrates, an aqueous epoxy resin and versions of curing compositions and methods of applying a coating on a substrate.
EFFECT: disclosed compositions are compatible with epoxy resins, have higher rate of curing and are capable of curing at lower temperatures without deterioration of coating properties.
19 cl, 3 dwg, 11 tbl, 5 ex
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