FIELD: final polishing of semiconductor substrates. SUBSTANCE: composition contains 40-50 % of low-molecular weight polyorganosiloxane rubber, 4-10 % of orthosilicic acid ester and 40-56 % of aluminum α-oxide. For the preparation of polishing composition all ingredients are mixed together. EFFECT: high quality of substrate surface to be treated. 3 tbl
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OPTICAL COMMUNICATION ELEMENT OF SCINTILLATION DETECTOR | 0 |
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IONIZING RADIATION DETECTOR | 2022 |
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Authors
Dates
1994-01-15—Published
1990-06-11—Filed