FIELD: microelectronics. SUBSTANCE: one or several bands made of dissipator material and a washer are fitted on the lead material made in the form of a band parallel to its edge. Several bands are fitted with a desired slot between them. The assembled packaged is coiled on a mandrel made of a high thermal expansion coefficient material. A band of material having a lower thermal expansion coefficient than those of the mandrel is coiled on the produced roll. The roll is heated to the welding temperature. The edges of the resulting shaped band are cut symmetrically to the dissipator. The band is rolled in rolls with a groove. EFFECT: increased efficiency of the process.
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