FIELD: glass treatment. SUBSTANCE: the etching solution comprises HF, NH4F and K2CO3 and further comprises NaCl and HNO3, the ratio of the components being as follows (wt % ): 50.0-60.0 HF; 20.0-30.0 NH4F; 8.0-10.0 K2CO3; 3.5-4.5 NaCl; and 6.0-7.5 HNO3. The use of the etching solution makes it possible to increase the glass treatment rate to 0.05-0.055 micron/S. EFFECT: improved properties of the glass. 1 tbl
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Authors
Dates
1994-05-30—Published
1991-10-28—Filed