METHOD FOR PRODUCING HIGH-MOLECULAR EPOXY RESIN Russian patent published in 1994 - IPC

FIELD: manufacturing heat-resistant epoxy polymers. SUBSTANCE: acetone and technical dioxydiphenylsulfone (being mixture of 3,3′,4,4′- dioxydiphenylsulfone isomers) are fed into reactor. Then phthalic anhydride and tri(p-aminophenyl)methane are fed consequently into reactor, the process is carried out at 20-30 C. Then low molecular epoxydiane resin (its molecular weight is 340-600) being preliminary heated to 50± 5^qC is added, then temperature is increased to 70-90 C and mixing within 30-60 min is carried out. Then temperature is increased to 100-120 C and mixing within 30-120 min simultaneously with distillation of acetone takes place. The process is carried out till high- molecular epoxy resin is produced, its molecular weight being 1000-1400, epoxy group content being 6-10%. EFFECT: improves efficiency of the method. 5 tbl