FIELD: chemistry.
SUBSTANCE: group of invention relates to thermosetting compositions of epoxy resins for prepregs, manufacturing thereof-based layered products and can be used in production of three-layered honeycomb panels from polymer composite materials, in particular panels for aircraft. Composition for obtaining binding agent for prepregs includes, wt.p.: highly molecular epoxy-diane resin (2-20), dicyandiamide as curing agent (4-8), as well as 2-methylimidazole (0.4-1.2), nitrogen-containing epoxy resin - product of condensation of paraaminophenol and epichlorohydrin (40-80), polyester resin - copolymer of dimethylterephthalate with ethyleneglycol and diethyleneglycol (6-12). In the process of obtaining binding agent dicyandiamide and 2-methylimidazole are preliminarily dispersed with part of nitrogen-containing epoxy resin at temperature 40-45°C. Highly molecular epoxy-diane resin is first fused with remaining part of nitrogen-containing epoxy resin and polyester resin at temperature 115-125°C, and then at temperature 45-55°C. Obtained melt is combined with dispersion, prepared in the process of preliminary dispersion. Prepreg, obtained on the basis of binding agent, includes 55-65 wt % of fibrous filling agent and 35-45 wt % of binding agent. Honeycomb panel is manufactured in form of package from middle layer of honeycomb filler and outer coverings from said prepreg.
EFFECT: obtaining thermosetting compositions of epoxy resins for prepregs.
6 cl, 4 tbl, 4 ex
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Authors
Dates
2015-08-10—Published
2014-01-13—Filed