FIELD: electronic and optic industries. SUBSTANCE: polishing material has porous fibrous base; additionally formed on it layer, that is relief structure with thickness of 0.1 - 0.3 of base maximum thickness and with rigidity in 1,5 - 2 times exceeding base rigidity, with uniformly alternating deepenings, making 0.2 - 0.4 of maximum thickness of base and area of which relates to total area as (1 - 3) : 1. Deepenings are filled with microporous polymer. In the case, base from side of additionally formed layer has relief surface, that repeats relief of additional layer, and located on the layer cell-type polymer layer, made of oblong cells, that are narrowing in direction to polishing surface and ending with holes. Cells are oriented perpendicularly to the surface and communicate to each other due to microporosity of their walls. EFFECT: method is used for material manufacture. 1 tbl
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Authors
Dates
1994-11-15—Published
1992-07-23—Filed