FIELD: process engineering.
SUBSTANCE: invention relates to machining of sapphire substrate. Proposed method comprises grinding first surface of said substrate using first bonded abrasive, grinding second substrate surface, opposite the first one, and grinding said first surface using second abrasive other than first one. Note here that second bonded abrasive features smaller grain size than first one. Note also that second abrasive is self-conditioning abrasive.
EFFECT: higher quality of plates with higher crystallographic parameters.
15 cl, 5 dwg, 6 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| LOT OF SAPPHIRE SUBSTRATES AND METHOD OF ITS PRODUCTION | 2007 |
|
RU2412037C1 |
| SAPPHIRE SUBSTRATE (VERSIONS) | 2007 |
|
RU2414550C1 |
| FLEXIBLE ABRASIVE TOOL AND METHOD OF FABRICATING ABRASIVE POWDER | 2008 |
|
RU2426635C2 |
| METHOD OF TREATMENT OF CERAMIC SUBSTRATE (VERSIONS) | 2004 |
|
RU2292372C2 |
| ABRASIVE PRODUCT | 2006 |
|
RU2361719C2 |
| GREASING-RESISTING AGENT FOR ABRASIVE | 2001 |
|
RU2246392C1 |
| METHOD OF PRODUCING ABRASIVE PRODUCTS | 2006 |
|
RU2358854C1 |
| MANUFACTURING METHODS OF ABRASIVE ITEMS | 2006 |
|
RU2376128C2 |
| METHOD OF CHEMICOMECHANICAL PLANARIZATION AND ARTICLES MANUFACTURED WITH THE AID THEREOF | 2000 |
|
RU2235747C2 |
| METHOD OF DEEP PRINTING FOR PRODUCING ABRASIVE SURFACES WITH APPLIED RELIEF | 1997 |
|
RU2173631C2 |
