FIELD: process engineering.
SUBSTANCE: invention relates to grinding of sapphire substrates. Proposed method comprises grinding every sapphire substrate using abrasive material so that first surface is oriented in c-plane. Lot of sapphire substrates comprises, at least, 20 substrates. Note here that each substrate has first surface with (i) orientation in c-plane, (ii) angle (θm) of disorientation of crystallographic m-plane and (iii) angle (θa) of disorientation of crystallographic a-plane. Note also that at least one (a) standard deviation of σm of said angle θm does not approximately exceed 0.0130 degrees, or (b) standard deviation σa of angle θa does not approximately exceed 0.0325 degrees.
EFFECT: higher surface quality.
15 cl, 5 dwg, 6 tbl
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Authors
Dates
2011-02-20—Published
2007-12-21—Filed