FIELD: electronics. SUBSTANCE: in process of manufacture of integrated circuit orientation of crystal with protrusions of base of mould is accomplished by base elements of outlet frame. Crystal is fixed under pressure not exceeding pressing pressure. Cone holes for coupling with attachment end of outlet frame are formed with potting of crystal. Workstock is cleaned by plasma-chemical machining. Protective coat is applied after deposition of film conductors. EFFECT: increased output of good articles. 5 cl, 4 dwg
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