METHOD FOR MANUFACTURING THREE-DIMENSIONAL POLYMERIC ELECTRONIC MODULE Russian patent published in 2002 - IPC

FIELD: electronic equipment with chip components. SUBSTANCE: proposed method for double scribing of semiconductor wafer and insulation of chip-to-polymer joint includes pre-locking of components in position by vacuum hold-down without adhesive followed by cleaning chip face; use is made of heat-conducting inserts in combination with heat sink which ensures adequate heat transfer from hot components. Manufacturing process involves use of available means and standard passive and active components. EFFECT: enhanced packing density, effective heat transfer, high reliability of interconnections. 7 cl, 12 dwg