FIELD: electricity.
SUBSTANCE: method for manufacture of 3D electronic device includes check-up of active components at the wafer, chipping into active components, purification, manufacturing of substrates for grouped micro IC cards, setting of components into openings in substrates for grouped micro IC cards, depositing of conductors to grouped micro IC cards, burn-in testing and check-up of components included into grouped micro IC cards, cutting out of fit micro IC cards and their assembly into a stack, depositing conductors at edge of the stack, installation of primary outputs, making heat sink, sealing of the device, final check-up and packing.
EFFECT: increasing packing density of electronic equipment and improving reliability factor of packing.
10 cl, 11 dwg
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