METHOD FOR PRODUCING POLYMERIC ELECTRONIC MODULE Russian patent published in 2008 - IPC H01L25/04 

FIELD: three-dimensional electronic module manufacture using multiple-output electronic components.

SUBSTANCE: proposed method includes manufacture of integrated-circuit boards for polymeric electronic module in the form of embossed boards carrying sunk conductors which are actually completely disposed in boards. They have minimal possible width at equivalent size much greater than similar flat conductor which makes it possible to provide external width of, and space between, conductors not over those on chip. Heat-transfer method provides for effective heat release both directly from heating components and from conductors carrying heavy load current.

EFFECT: ability of retaining all advantages of three-dimensional modules and for using this method in manufacturing state-of-the-art electronic equipment.

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