METHOD FOR ENCAPSULATION OF ELECTRONIC COMPONENTS Russian patent published in 2013 - IPC H01L21/52 

FIELD: electricity.

SUBSTANCE: method for encapsulation of electronic components combines vacuum pouring with application of pressure at a compound, guarantees high-quality shaping and increased mechanical and thermal characteristics of products. Also the control of product quality is facilitated by means of application of a transparent base of a form. The method is applicable in production of a wide gamma of electronics and electric products, and also domestic items.

EFFECT: task of encapsulation of electronic components is solved without pressurrising and using expensive rigging, which is especially important in individual production of single products of electronic equipment.

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