FIELD: electrical and radio engineering. SUBSTANCE: dielectric paste includes low-melting glass, refractory filling agent, organic binder. It is injected with second low-melting glass which melting temperature amounts to (1.1-1.45) of melting temperature of first low-melting glass. Paste has following proportion of components, parts by weight; first low-melting glass 15-30; second low-melting glass 15-30; refractory filling agent 30-50, organic binder being the balance. EFFECT: enhanced stability of shape of separating elements. 1 tbl
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Authors
Dates
1994-12-30—Published
1991-01-02—Filed