FIELD: electronic engineering; gas panel manufacture.
SUBSTANCE: proposed dielectric composition incorporates low-melting glass and high-melting filler powders wherein particles of low-melting glass and high-melting filler powders have at least one of following shapes: spherical, cylindrical, or planar; amounts of low-melting glass and high-melting filler are chosen from equation , where k1 = ρ1/ρ2 is factor characterizing physical of low-melting glass and high-melting filler; k2 = V1/V2 is factor characterizing packing density of particles of low-melting glass and high-melting filler powders; m1 and m2 is amount of low-melting glass and high-melting filler, respectively, g; ρ1 and ρ2 is density of low-melting glass and high-melting filler, respectively. V1 and V2 is volume occupied by low-melting glass and high-melting filler, respectively, cm3.
EFFECT: enhanced structure density of structural components.
1 cl, 1 tbl
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Authors
Dates
2005-08-20—Published
2004-03-09—Filed