DEVICE FOR LOW-TEMPERATURE DIRECT CONNECTION OF SEMICONDUCTOR PLATES Russian patent published in 1995 - IPC

FIELD: semiconductor engineering. SUBSTANCE: device for low- temperature direct connection of semiconductor plates has base, centrifuge with rotary table for plate fastening unit, cover for creating enclosed space above plates being connected, plate heating unit; plate fastening unit has plate holder and plates separating retainer; plate fastening unit has in addition snap ring with slots, and plate holder is provided with cylindrical helical torsional springs mounted for loading snap ring in respect to holder; the latter and snap ring are joined by means of magnetically-soft metal pin made for engagement of magnets on device cover; plates separating retainers are placed in holder slots and loaded with cylindrical helical compressing springs in respect to snap ring. Device base and centrifuge rotary table carry set of magnets equally spaced from axis of revolution of centrifuge; cover providing enclosed space above plates has magnets spring-loaded in vertical direction; cover magnets are mounted for their coaxial arrangement relative to magnetically-soft metal pin with device cover closed and in case of reversal of centrifuge magnets polarity to device base magnets. Heating unit is essentially nozzle with filter installed on device base and joined with system feeding compressed air or nitrogen from supply mains and has heating element built for heating air or nitrogen jet. EFFECT: improved design. 2 cl, 3 dwg